solder ball meaning in Chinese
焊锡球
锡珠
Examples
- Screen printing technology for solder ball flip chip for smt
倒装芯片及晶圆和基底凸起的网版印刷技术一 - So it will result in rigidity skin & block and solder balls etc
产生的后果是：锡膏出现硬皮、硬块、难熔并产生大量锡球等。 - Its development is based upon the solution of the reliability of solder ball , which is one of the key problems
而焊点可靠性问题是发展bga csp技术需解决的关键问题之一。 - This could cause a variety of solder defects , ranging from solder balling to non - wetting to damaged devices to voiding to charred residues
这样会产生许多焊接缺陷，诸如锡球、润湿不良、破坏元器件、空洞、碳化等。 - Often confused with solder balling , solder beading is a defect recognized by one or a few larger balls , generally located around chip caps and resistors
锡珠经常会和锡球混淆，锡珠一个或几个大的球，通常会位于小电容或电阻旁边。